发明名称 |
STRUCTURES AND METHODS FOR PHOTO-PATTERNABLE LOW-k (PPLK) INTEGRATION |
摘要 |
An interconnect structure is provided which includes at least one patterned and cured low-k material located directly on a surface of a substrate; and at least one least one conductively filled region embedded within an interconnect pattern located within the at least one patterned and cured low-k material, wherein the at least one conductively filled region has an inflection point at a lower region of the interconnect pattern that is in proximity to an upper surface of the substrate and the interconnect region having an upper region that has substantially straight sidewalls.
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申请公布号 |
US2013001781(A1) |
申请公布日期 |
2013.01.03 |
申请号 |
US201213602126 |
申请日期 |
2012.09.01 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION;DARNON MAXIME;LIN QINGHUANG |
发明人 |
DARNON MAXIME;LIN QINGHUANG |
分类号 |
H01L23/532;H01L23/522 |
主分类号 |
H01L23/532 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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