ENCAPSULATION STRUCTURE FOR AN OPTO-ELECTRONIC COMPONENT, AND METHOD FOR ENCAPSULATING AN OPTOELECTRONIC COMPONENT

摘要

An encapsulation structure (300) for an opto-electronic component (400) has the following: a thin-layer encapsulation (301) for protecting the opto-electronic component against chemical pollutants, an adhesive layer (302) produced on the thin-layer encapsulation and a top layer (303), produced on the adhesive layer, for protecting the thin-layer encapsulation and/or the opto-electronic component against mechanical damage.