| 摘要 |
<p>A package wiring substrate (300) has a first conductor pattern (14), and a motherboard (13) has a second conductor pattern (15). The second conductor pattern (15) is formed in a region that faces at least part of the first conductor pattern (14), in other words, in a region on which, in a plane view, at least part of the first conductor pattern (14) is overlapped. A repeated conductor structure is formed using either or both of the first conductor pattern (14) and the second conductor pattern (15). The first conductor pattern (14) and the second conductor pattern (15) constitute at least part of an EBG structure (20). The second conductor pattern (15) is electrically connected to another conductor that the motherboard (13) has.</p> |
