发明名称 Field transistor structure manufactured using gate last process
摘要 <p>According to embodiments of the invention, a field transistor structure is provided. The field transistor structure includes a semiconductor substrate, a metal gate, a polycrystalline silicon (polysilicon) layer, and first and second metal portions. The polysilicon layer has first, second, third, and fourth sides and is disposed between the semiconductor substrate on the first side and the metal gate on the second side. The polysilicon layer is also disposed between the first and second metal portions on the third and fourth sides. According to some embodiments of the present invention, the field transistor structure may also include a thin metal layer disposed between the polysilicon layer and the semiconductor substrate. The thin metal layer may be electronically coupled to each of the first and second metal portions.</p>
申请公布号 EP2541606(A2) 申请公布日期 2013.01.02
申请号 EP20120004824 申请日期 2012.06.27
申请人 BROADCOM CORPORATION 发明人 LU, CHAO-YANG;SHIAU, GUANG-JYE;ITO, AKIRA
分类号 H01L29/78;G11C17/16;H01L29/786 主分类号 H01L29/78
代理机构 代理人
主权项
地址