发明名称 |
Wavelength-division multiplexing for use in multi-chip systems |
摘要 |
Embodiments of a system that includes an array of chip modules (CMs) is described. In this system, a given CM in the array includes a semiconductor die that is configured to communicate data signals with one or more adjacent CMs through electromagnetic proximity communication using proximity connectors. Note that the proximity connectors are proximate to a surface of the semiconductor die. Moreover, the given CM is configured to communicate optical signals with other CMs through an optical signal path using optical communication, and the optical signals are encoded using wavelength-division multiplexing (WDM).
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申请公布号 |
US8346087(B2) |
申请公布日期 |
2013.01.01 |
申请号 |
US20070863815 |
申请日期 |
2007.09.28 |
申请人 |
ORACLE AMERICA, INC.;O'KRAFKA BRIAN W.;KRISHNAMOORTHY ASHOK V.;CUNNINGHAM JOHN E.;ZHENG XUEHZE;SHARAPOV ILYA A.;HO RONALD |
发明人 |
O'KRAFKA BRIAN W.;KRISHNAMOORTHY ASHOK V.;CUNNINGHAM JOHN E.;ZHENG XUEHZE;SHARAPOV ILYA A.;HO RONALD |
分类号 |
H04B10/00 |
主分类号 |
H04B10/00 |
代理机构 |
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地址 |
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