发明名称 |
Heat-dissipating device for supplying cold airflow |
摘要 |
A heat-dissipating device (1) includes a casing (10) and a thermal insulation plate (20) provided within the casing (10). The thermal insulating plate (20) divides the interior of the casing (10) into a first accommodating space (101) and a second accommodating space (102). A hot air outlet (121) and a first air inlet (122) of the casing (10) are in communication with the first accommodating space (101). A cold air outlet (110) and a second air inlet (123) of the casing (10) are in communication with the second accommodating space (102). A thermoelectric cooling chip (30) is disposed in a through-hole (200) of the thermal insulation plate (20) and has a hot-end surface (31) facing the first accommodating space (101) and a cold-end surface (32) facing the second accommodating space (102). A heat-dissipating module (40) is received in the first accommodating space (101). A cold-airflow supplying module (50) is received in the second accommodating space (102). The heat generated by the hot-end surface (31) is dissipated to the hot air outlet (121) by the thermal conduction of the heat-dissipating module (40). The cold generated by the cold-end surface (32) is conducted and distributed uniformly by the cold-airflow supplying module (50) to the cold air outlet (110).
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申请公布号 |
US8341967(B2) |
申请公布日期 |
2013.01.01 |
申请号 |
US20100707805 |
申请日期 |
2010.02.18 |
申请人 |
GOLDEN SUN NEWS TECHNIQUES CO., LTD.;CPUMATE INC.;CHENG CHIH-HUNG;HSU KEN;LIN CHEN-HSIANG;LIN KUO-LEN |
发明人 |
CHENG CHIH-HUNG;HSU KEN;LIN CHEN-HSIANG;LIN KUO-LEN |
分类号 |
F25B21/02 |
主分类号 |
F25B21/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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