DISLOCATION AND STRESS MANAGEMENT BY MASK-LESS PROCESSES USING SUBSTRATE PATTERNING AND METHODS FOR DEVICE FABRICATION

摘要

Structures and methods for producing active layer stacks of lattice matched, lattice mismatched and thermally mismatched semiconductor materials, with low threading dislocation densities, no layer cracking and minimized wafer bowing, by using epitaxial growth onto elevated substrate regions in a mask-less process.