发明名称 |
METHODS FOR CMOS-MEMS INTEGRATED DEVICES WITH MULTIPLE SEALED CAVITIES MAINTAINED AT VARIOUS PRESSURES |
摘要 |
A Microelectromechanical systems (MEMS) structure comprises a MEMS wafer. A MEMS wafer includes a handle wafer with cavities bonded to a device wafer through a dielectric layer disposed between the handle and device wafers. The MEMS wafer also includes a moveable portion of the device wafer suspended over a cavity in the handle wafer. Four methods are described to create two or more enclosures having multiple gas pressure or compositions on a single substrate including, each enclosure containing a moveable portion. The methods include: A. Forming a secondary sealed enclosure, B. Creating multiple ambient enclosures during wafer bonding, C. Creating and breaching an internal gas reservoir, and D. Forming and subsequently sealing a controlled leak/breach into the enclosure.
|
申请公布号 |
US2012326248(A1) |
申请公布日期 |
2012.12.27 |
申请号 |
US201213535180 |
申请日期 |
2012.06.27 |
申请人 |
DANEMAN MICHAEL;LIM MARTIN;HUANG KEGANG;TCHERTKOV IGOR;INVENSENSE, INC. |
发明人 |
DANEMAN MICHAEL;LIM MARTIN;HUANG KEGANG;TCHERTKOV IGOR |
分类号 |
H01L29/84;H01L21/02 |
主分类号 |
H01L29/84 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|