| 摘要 |
A printed wiring board is configured such that copper-laminated plates and prepregs are alternately laminated and surface conductive layers are arranged on the outermost positions outside the prepregs, wherein all leading wires from pads for surface-mount parts to be mounted on the surface of the printed wiring board are connected to inner conductive layers of the copper laminated plates through blind via holes connecting the surface conductive layer and the copper-laminated plate therebelow, and inner via holes connecting conductive layers on the top and rear surfaces of at least one of the copper-laminated plates that is nearest to the surface conductive layer are provided and a conductive film is formed in the inner via holes.
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