发明名称 POLYMER STRUCTURE
摘要 <p>A structure comprising a polymer and a thermally conductive filler dispersed therein is configured so that 10-100 wt.% of the thermally conductive filler has been coated with a material different from the thermally conductive filler, the material which is different from the thermally conductive filler being at least one substance selected from the group consisting of organic substances that are insoluble in organic solvents and of metal oxides, metal nitrides, and boron nitride that have a specific surface area of 100 m2/g or less. Since the surface-coated thermally conductive filler has improved dispersibility, use of this filler effectively inhibits the structure from suffering an increase in brittleness due to the filler even when the filler was incorporated into the polymer in a large quantity.</p>
申请公布号 WO2012176363(A1) 申请公布日期 2012.12.27
申请号 WO2012JP02378 申请日期 2012.04.05
申请人 PANASONIC CORPORATION;HORI, KENYA 发明人 HORI, KENYA
分类号 C08L101/00;C01B31/04;C08K9/00;H01L23/373 主分类号 C08L101/00
代理机构 代理人
主权项
地址