发明名称 |
METHOD OF ASSEMBLING SEMICONDUCTOR DEVICE |
摘要 |
A method of assembling a semiconductor device includes providing a conductive lead frame panel and selectively half-etching a top side of the lead frame panel to provide a pin pads. A flip chip die is attached and electrically connected to the pin pads and then the lead frame panel and die are encapsulated with molding compound. A second selective half etching step is performed on a backside of the lead frame panel to form a plurality of separate input/output pins. The side walls of each input/output pin include arcuate surfaces in cross-section.
|
申请公布号 |
US2012326288(A1) |
申请公布日期 |
2012.12.27 |
申请号 |
US201213489462 |
申请日期 |
2012.06.06 |
申请人 |
FREESCALE SEMICONDUCTOR, INC |
发明人 |
HUANG MEIQUAN;LIU HEJIN;WANG ZHIJIE;YE DEHONG;ZHANG HANMIN |
分类号 |
H01L21/56;H01L23/495 |
主分类号 |
H01L21/56 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|