IMAGE PICKUP LENS, LENS ARRAY, METHOD FOR PRODUCING IMAGE PICKUP LENS, AND IMAGE PICKUP MODULE

摘要

A wafer-level lens of the present invention is produced by cutting out one of a plurality of lenses from at least one lens array having a wafer on which the plurality of lenses are provided, the wafer-level lens being cut out from the at least one lens array so as to have a cross section which is perpendicular to an optical axis of the wafer-level lens and is a hexagon.