| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for providing good adhesion between thin film metal layers and a dielectric and simultaneously eliminating or reducing an irregular surface of the dielectric. <P>SOLUTION: An adhesion solution containing curable amine compounds and curable epoxy compounds are applied to a dielectric material and then dried, and a thin metal layer is electrolessly plated on the dielectric material. The composite is then annealed to cure the amine and epoxy compounds. The adhesion solution contains an excess amount of curable amine over curable epoxy. The adhesion solution and method may be used in the manufacture of printed circuit boards. <P>COPYRIGHT: (C)2013,JPO&INPIT |
