| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve the problem of a resin encapsulated semiconductor device which is assembled using a lead frame having a multiple unit device regions disposed thereon in matrix form, that a resin unfilled defect in the resin encapsulation process tends to increase as the package is produced to increasingly finer design rules, so that if, when the lead frame is separated into individual unit device regions by a cutting die, etc., there exists even a single unfilled unit device region, the lead frame may scatter into pieces when it is cut by the cutting die, etc., thereby damaging the cutting die or the product, a problem which makes it necessary to inspect lead frames for deficient package filling before they are cut by the cutting die, etc., to eliminate a lead frame having filling defects from the subsequent processing. <P>SOLUTION: In an individual molding system of semiconductor device manufacturing method, the present invention aims to apply repair processing to a unit device region which has had an unfilled defect discovered after molding. <P>COPYRIGHT: (C)2013,JPO&INPIT |
