| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a post-treatment agent by which a tin or tin alloy plating film can be suppressed from discoloration under high-humidity and high-temperature conditions, deterioration of solder wettability, and discoloration by reflow oxidation, thereby capable of improving the reliability of solder bonding of electronic parts. <P>SOLUTION: The post-treatment agent includes: one or more anionic surfactants selected from among a polyoxyalkylene alkylether phosphate, a polyoxyalkylene alkylphenyl ether phosphate, a polyoxyalkylene phenyl ether phosphate, a polyoxyalkylene naphthyl ether phosphate, a polyoxyalkylene styrenated phenyl ether phosphate, and a salt thereof; and one or more phosphoric acid compounds selected from among phosphoric acid, condensed phosphoric acid, phosphorous acid, hypophosphorous acid, and a water soluble salt thereof. <P>COPYRIGHT: (C)2013,JPO&INPIT |
