| 摘要 |
<P>PROBLEM TO BE SOLVED: To properly cool exothermic heat due to electronic apparatuses even when a plurality of types of racks having different methods for housing electronic apparatuses are mixedly mounted in an electronic apparatus housing device which houses the electronic apparatuses in the respective racks and is used as a data center. <P>SOLUTION: In an electronic apparatus housing device 1, racks 11 are installed in an ISO standard container 2, and electronic apparatuses 12 are housed in the respective racks 11 while front faces 12a of the electronic apparatus 12 communicate with air intake areas A1, A2. An exhaust chimney 3 is provided on back faces 12b of the electronic apparatus 12 so as to take and discharge heated air exhausted from the electronic apparatus 12. In the respective racks 11, a heat exchanger 17 which heat-exchanges the heated air exhausted from the exhaust chimney 3 and supplies cool air to the air intake areas A1, A2 is provided. Since the heat exchanger 17 is provided for the respective racks 11 on a one-to-one basis, exhaust heat treatment of the electronic apparatus 12 can be carried out at the rack 11 units and proper cooling of exothermic heat due to the electronic apparatus 12 can be easily achieved even when the plurality of racks 11 are installed in the ISO standard container 2. <P>COPYRIGHT: (C)2013,JPO&INPIT |
