发明名称 |
Component temperature control |
摘要 |
There is disclosed an electronic apparatus comprising a chip (11) within a casing (13). A thermoelectric cooler (14) has thermal connections to the chip and the casing and is configured to transport heat from the chip to the casing. A temperature measuring device (15) is provided for determining the temperature of the chip. A control system is configured to maintain the chip at a target temperature by controlling current supplied to the thermoelectric cooler in response to the measured temperature. A temperature selection system is configured to select the chip target temperature dynamically on the basis of the casing temperature. |
申请公布号 |
EP2450767(A3) |
申请公布日期 |
2012.12.26 |
申请号 |
EP20100190213 |
申请日期 |
2010.11.05 |
申请人 |
OCLARO TECHNOLOGY LIMITED |
发明人 |
ZAYER, NADHUM KADHUM;DRAKE, JONATHAN STUART |
分类号 |
G05D23/24;F25B21/02;H01S5/024 |
主分类号 |
G05D23/24 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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