发明名称 |
Inductor element, inductor element manufacturing method, and semiconductor device with inductor element mounted thereon |
摘要 |
An inductor element is formed in a multiple layer lead structure including a lead, an insulative layer that insulates leads above and below, and a via provided in the insulative layer and connecting leads above and below wherein lead layers are multiply laminated layers, characterized in that: at least a portion of at least a pair of vertically adjacent leads are coiled leads; the coiled leads are connected in series, wherein current directions of vertically adjacent coiled leads are the same by a via provided on an end portion thereof, and form a serial inductance; and an inter-lead capacitance of the vertically adjacent coiled leads is larger than an inter-lead capacitance between other coiled leads formed in the same lead layer.
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申请公布号 |
US8339230(B2) |
申请公布日期 |
2012.12.25 |
申请号 |
US20070375944 |
申请日期 |
2007.08.01 |
申请人 |
HIJIOKA KENICHIRO;TANABE AKIRA;HAYASHI YOSHIHIRO;RENESAS ELECTRONICS CORPORATION |
发明人 |
HIJIOKA KENICHIRO;TANABE AKIRA;HAYASHI YOSHIHIRO |
分类号 |
H01F5/00;H01F7/06;H01F27/28 |
主分类号 |
H01F5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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