发明名称 Inductor element, inductor element manufacturing method, and semiconductor device with inductor element mounted thereon
摘要 An inductor element is formed in a multiple layer lead structure including a lead, an insulative layer that insulates leads above and below, and a via provided in the insulative layer and connecting leads above and below wherein lead layers are multiply laminated layers, characterized in that: at least a portion of at least a pair of vertically adjacent leads are coiled leads; the coiled leads are connected in series, wherein current directions of vertically adjacent coiled leads are the same by a via provided on an end portion thereof, and form a serial inductance; and an inter-lead capacitance of the vertically adjacent coiled leads is larger than an inter-lead capacitance between other coiled leads formed in the same lead layer.
申请公布号 US8339230(B2) 申请公布日期 2012.12.25
申请号 US20070375944 申请日期 2007.08.01
申请人 HIJIOKA KENICHIRO;TANABE AKIRA;HAYASHI YOSHIHIRO;RENESAS ELECTRONICS CORPORATION 发明人 HIJIOKA KENICHIRO;TANABE AKIRA;HAYASHI YOSHIHIRO
分类号 H01F5/00;H01F7/06;H01F27/28 主分类号 H01F5/00
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