发明名称 |
Method for cleaning elements in vacuum chamber and apparatus for processing substrates |
摘要 |
To clean an element in a vacuum chamber by causing particles sticking to the element to scatter, the present invention uses a means for applying a voltage to the element and causing the particles to scatter by utilizing Maxwell's stress, a means for electrically charging the particles and causing the particles to scatter by utilizing the Coulomb force, a means for introducing a gas into the vacuum chamber and causing the particles sticking to the element to scatter by causing a gas shock wave to hit the element, a means for heating the element and causing the particles to scatter by utilizing the thermal stress and thermophoretic force, or a means for causing the particles to scatter by applying mechanical vibrations to the element. The thus scattered particles are removed by carrying them in a gas flow in a relatively high pressure atmosphere. |
申请公布号 |
US8337629(B2) |
申请公布日期 |
2012.12.25 |
申请号 |
US201213495404 |
申请日期 |
2012.06.13 |
申请人 |
MORIYA TSUYOSHI;NAGAIKE HIROSHI;NAKAYAMA HIROYUKI;TOKYO ELECTRON LIMITED |
发明人 |
MORIYA TSUYOSHI;NAGAIKE HIROSHI;NAKAYAMA HIROYUKI |
分类号 |
B08B5/00;B08B5/02;B08B3/12;B08B6/00;B08B7/00;C23F1/00;H01L21/00;H01L21/30;H01L21/304;H01L21/683 |
主分类号 |
B08B5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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