发明名称 |
Transfer method for thin film nanomembrane structures |
摘要 |
A transfer process for silicon nanomembranes (SiNM) may involve treating a recipient substrate with a polymer structural support. After treating the recipient substrate, a substrate containing the intended transferable devices may be brought in direct contact with the aforementioned polymer layer. The two substrates may then go through a Deep Reactive Ion Etch (DRIE) to remove at least a portion of the substrate containing the devices. Oxide may be selectively removed with a buffered oxide wet etch, leaving the transferred SiNM on the recipient substrate with the Underlying polymer layer. |
申请公布号 |
US8338268(B2) |
申请公布日期 |
2012.12.25 |
申请号 |
US201113050686 |
申请日期 |
2011.03.17 |
申请人 |
ZABLOCKI MATHEW JOSEPH;SHARKAWY AHMED;PRATHER DENNIS W.;LUMILANT, INC. |
发明人 |
ZABLOCKI MATHEW JOSEPH;SHARKAWY AHMED;PRATHER DENNIS W. |
分类号 |
H01L21/762 |
主分类号 |
H01L21/762 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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