发明名称 |
IMS (INJECTION MOLDED SOLDER) WITH TWO RESIST LAYERS FOR FORMING SOLDER BUMPS ON SUBSTRATES |
摘要 |
A photoresist layer is applied over a solder resist layer on a substrate such as a wafer. Openings in the solder resist and photoresist layers are filled with flux-free molten solder using IMS. The process is applicable to fine pitch applications and chip size packaging substrates. A protection layer may be employed to facilitate removal of the photoresist layer from the substrate. An oversized substrate including an adhesive layer on a peripheral area may be employed for providing greater adhesion of a dry film layer to the peripheral area of the substrate than the central portion thereof. The peripheral area is removed following IMS.
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申请公布号 |
US2012318855(A1) |
申请公布日期 |
2012.12.20 |
申请号 |
US201113164728 |
申请日期 |
2011.06.20 |
申请人 |
MCLEOD MARK H.;NAH JAE-WOONG;INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
MCLEOD MARK H.;NAH JAE-WOONG |
分类号 |
B23K1/20 |
主分类号 |
B23K1/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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