发明名称 METHOD AND APPARATUS FOR MONITORING POLISHING SURFACE OF POLISHING PAD USED FOR POLISHING DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a method for substantially reducing cost and time which are spent for recipe tuning in conditioning a polishing pad and monitoring a polishing surface of a polishing pad without unsticking the polishing pad from a polishing table. <P>SOLUTION: According to this method, a rotating dresser 50 is swung on the polishing surface 22a of the polishing pad 22 to thereby condition the polishing surface 22a and the height of the polishing surface 22a is measured during the conditioning of the polishing surface 22a. Then, the position is calculated at which the height of the polishing surface 22a has been measured on a two-dimensional plane defined on the polishing surface 22a to repeat the measurement of the height of the polishing surface 22a and the calculation of the measured position of the height, thus producing a height distribution within the polishing surface 22a. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2012250309(A) 申请公布日期 2012.12.20
申请号 JP20110124057 申请日期 2011.06.02
申请人 EBARA CORP 发明人 SHINOZAKI HIROYUKI;SHIMANO TAKAHIRO;IMAMURA CHO;NAKAMURA AKIRA
分类号 B24B53/00;B24B53/017 主分类号 B24B53/00
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