| 发明名称 |
INTERPOSER TESTING STRUCTURE AND METHOD |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an interposer testing structure and an interposer testing method. <P>SOLUTION: One embodiment discloses a structure including an interposer. The interposer has a testing structure extending around the interposer, and at least a part of the testing structure is located in a first re-wiring element. The first re-wiring element is located on a first surface of a substrate of the interposer. The testing structure is an intermediate product and electrically connects with at least two probe pads. <P>COPYRIGHT: (C)2013,JPO&INPIT |
| 申请公布号 |
JP2012253345(A) |
申请公布日期 |
2012.12.20 |
| 申请号 |
JP20120123100 |
申请日期 |
2012.05.30 |
| 申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD |
发明人 |
LIU TZUAN-HORNG;YU CHEN-HUA;HU HSIEN-PIN;WANG TZU-YU;WU WEI-CHENG;HOU SHANG-YUN;JENG SHIN-PUU |
| 分类号 |
H01L23/32;H01L23/12;H05K3/46 |
主分类号 |
H01L23/32 |
| 代理机构 |
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