| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device having a long lifespan and high reliability by causing the semiconductor device to have a configuration of suppressing thermal deterioration of a semiconductor element. <P>SOLUTION: A semiconductor element 1 is mounted on a support substrate 2. A thermal conducting part 3 is formed on at least a surface 2f of the support substrate 2. The semiconductor element 1 is mounted on the thermal conducting part 3 via a high-heat conducting adhesive agent 6. <P>COPYRIGHT: (C)2013,JPO&INPIT |
