| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a phenolic resin composition that suppresses generation of aggregates in an unexposed part during development and can be used as an alternative for a polyimide resin and a polybenzoxazole resin, and to provide a method for producing a cured relief pattern using the phenolic resin composition, and a semiconductor device comprising the cured relief pattern. <P>SOLUTION: The phenolic resin composition comprises: a phenolic resin (A) having a specified structure; a phenol compound (B) having a structure expressed by the general formula shown in the figure; and a photosensitive agent (C). In the general formula, R<SB POS="POST">6</SB>represents an aliphatic group having 3 or more carbon atoms and optionally having a substituent, an alicyclic group having 3 or more carbon atoms and optionally having a substituent, or an aromatic group optionally having a substituent; Y represents O, NH or a single bond; and b represents an integer of 2 or 3. <P>COPYRIGHT: (C)2013,JPO&INPIT |
