发明名称 THREE-DIMENSIONAL BOARD STRUCTURE AND METHOD FOR MAKING THE SAME
摘要 The present invention is to provide a three-dimensional board structure and method thereof by sequentially coating an adhesive on a plurality of veneers containing plant fibers, sequentially bonding the veneers together to form a multilayer board, penetrating and pressing the multilayer board by using a plurality of spikes arranged on a tool for deforming and breaking the plant fibers around peripheries of penetrated portions of the veneers, and removing the spikes from the multilayer board, such that the plant fibers around the peripheries of the penetrated portions of any two adjacent veneers are entangled with each other to form three-dimensional connecting portions in the multilayer board. Since the adhesive will permeate into the three-dimensional connecting portions due to penetration of the spikes and pressure of the tool, the three-dimensional connecting portions between the adjacent veneers and the adhesive permeated therein make the multilayer board having a three-dimensional bonding strength accordingly.
申请公布号 US2012321847(A1) 申请公布日期 2012.12.20
申请号 US201213601043 申请日期 2012.08.31
申请人 WANG CHAO-LANG 发明人 WANG CHAO-LANG
分类号 B32B3/10 主分类号 B32B3/10
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