RETENTION DEVICE AND RETENTION METHOD

摘要

This retention device (10) is provided with: a first suction part (11) that sucks at a wafer (substrate) (2) on the side to which dicing tape (support membrane) (3) adheres; a structure (14) that supports a dicing frame (4) and also covers a first region sandwiched between the wafer (2) and the dicing frame (4) on the surface of the side of the dicing tape (3) to which the wafer (2) does not adhere; and a second suction part (12) that at least seals between the structure (14) and either the dicing frame (4) or the first region.