| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a stack package manufactured using a molded reconfigured wafer, simplified in manufacturing process and capable of being decreased in manufacturing cost, and a method for manufacturing the stack package. <P>SOLUTION: A stack package includes at least two or more stacked package units. Each package unit comprises: a semiconductor chip having a bonding pad on an upper surface thereof; a molding part formed to surround the side surfaces of the semiconductor chip; a through-electrode formed in the molding part; and a redistribution interconnect formed so as to connect the through-electrode and the bonding pad adjacent to the through electrode with each other. The through-electrode and the redistribution interconnect are integrally formed. <P>COPYRIGHT: (C)2013,JPO&INPIT |
