发明名称 SILICONE RESIN COMPOSITION AND THERMAL CONDUCTIVE SHEET
摘要 <P>PROBLEM TO BE SOLVED: To provide a silicone resin composition capable of achieving the improvement of flexibility and thermal conductivity, and to provide a thermal conductive sheet prepared from the silicone resin composition. <P>SOLUTION: There is provided a silicone resin composition comprising boron nitride and a borosiloxane resin containing a B-O-Si bond, which borosiloxane resin is formed from a material component comprising a condensation-reactive silicone resin and a boron atom complex and has a boron atom complex containing ratio of 0.5-10 pts.mass per 100 pts.mass material component. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2012251101(A) 申请公布日期 2012.12.20
申请号 JP20110126202 申请日期 2011.06.06
申请人 NITTO DENKO CORP 发明人 HIRANO KEISUKE
分类号 C08L83/08;C08G77/398;C08J3/20;C08J5/18;C08K3/36;C08K3/38 主分类号 C08L83/08
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