PLATING APPARATUS, AND METHOD OF PRODUCING PLATED SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To provide a plating apparatus capable of removing fine irregularities present on the surface of a substrate and of making the surface smooth, and to provide a method of producing a plated substrate of excellent smoothness.

SOLUTION: In the plating apparatus, a workpiece of a long-sheet shape is continuously delivered from a workpiece feeder to at least one treatment tank including a plating tank to plate the same and thereafter the plated workpiece is continuously wound onto a workpiece winder. The apparatus is characterized by including a heat treatment device disposed between the workpiece winder and the plating tank.

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