发明名称 |
EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION, AND SEMICONDUCTOR DEVICE USING THE SAME |
摘要 |
Disclosed are an epoxy resin composition for semiconductor encapsulation containing (A) an epoxy resin, (B) a curing agent, (C) an inorganic filler material, (D) a hydrocarbon compound having structures of formula (1) and formula (2), and (E) a hydrocarbon compound having an ester group; and a semiconductor device including a semiconductor element encapsulated with the epoxy resin composition for semiconductor encapsulation. CH2—CH2 (1) CH═CH (2)
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申请公布号 |
US2012319306(A1) |
申请公布日期 |
2012.12.20 |
申请号 |
US201113581637 |
申请日期 |
2011.03.16 |
申请人 |
SUMITOMO BAKELITE CO., LTD. |
发明人 |
TABEI JUN-ICHI |
分类号 |
C09D163/00;C08K5/01;C08K5/10;H01L23/29 |
主分类号 |
C09D163/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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