| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device capable of improving adhesion between a columnar electrode and a resin layer which adheres tightly to a side surface of the columnar electrode, and a semiconductor device obtained thereby. <P>SOLUTION: A semiconductor device 101 (and a method of manufacturing the same) according to the present embodiment is manufactured by the steps of: preparing a semiconductor chip 10; forming a columnar electrode 24, which is electrically connected to a pad electrode 12 and having a concavo-convex shape on a side surface, on the semiconductor chip 10; and forming a resin layer 25, which adheres tightly to the side surface of the columnar electrode 24, on the semiconductor chip 10. <P>COPYRIGHT: (C)2013,JPO&INPIT |
