| 摘要 |
<p>PURPOSE: A carrier material for a thin film substrate is provided to not generate wrinkles or scratches even in case used in a processing process or conveying process in state the thin film substrate is attached to a carrier material, to maintain the shape of a thin film substrate, and to have excellent workability. CONSTITUTION: A carrier material for a thin film substrate(10) comprises a support(1) which consists of a polyester-based resin with the thickness of 50-150 micron, and an adhesive film(2) formed at least one side of the support. The sum of breaking strengths in the first direction of the support and in the second direction which vertically crosses the first direction is 300-700 N/10mm. The initial adhesion(23°C after 30 minutes) of the adhesive film is 0.5 N/25mm or less. The support contains polyethylene terephthalate. The thin film substrate is a resin film.</p> |
