| 摘要 |
A heat dissipation module with multiple porosities is used for cooling the connected heating electrical components and comprises: a cooling body, a thermal conductive part, and a heating electrical component. The cooling body is a kind of composite ceramic with multiple porosities, and the cooling body comprises at least a cavity to accommodate the thermal conductive part. The heating electrical component is a piece of PCB with electrical conductive circuits and lighting device or a CPU. |
