WIRING BOARD AND WIRING BOARD MANUFACTURING METHOD

摘要

The wiring board has a core substrate section, an insulating layer, second wiring, and via sections made of a cured via paste. The via paste comprises a first latent hardener, a second latent hardener, an uncured resin mixture, and conductive particles. The softening temperature of the first latent hardener and the softening temperature of the second latent hardener are both 40ºC-200ºC inclusive, and the difference between the softening temperature of the first latent hardener and the softening temperature of the second latent hardener is 10ºC-140ºC inclusive.