Grounding mechanism for slide-type electronic devices

摘要

A grounding mechanism is used for a slide-type electronic device including a first housing and a second housing. The grounding mechanism includes a grounding tab for attachment to the first housing and an opening defined in the second housing. Two sidewalls are formed in the opening, and a conductive layer is coated on each sidewall. When the grounding tab is received in the opening, the grounding tab abuts against the conductive layer of the sidewalls for electronically connecting the first housing to the second housing.