发明名称 |
QFN(QUAD FLAT NO-LEADS) PACKAGE AND THE METHOD OF FABRICATING THE SAME |
摘要 |
PURPOSE: A QFN(Guad Flat No-leads) package and a manufacturing method are provided to minimize the volume of the package by not using a die paddle. CONSTITUTION: A lead frame includes a ground ring(110) and a plurality of external connectors(120). A bonding wire(20) electrically connects a semiconductor chip(10) and the lead frame. The bonding wire includes a first bonding wire(22) and a second bonding wire(24). The first bonding wire and the second bonding wire are connected to a first side(12) of the semiconductor chip. An encapsulating material(300) surrounds the semiconductor chip and the bonding wire. |
申请公布号 |
KR20120136203(A) |
申请公布日期 |
2012.12.18 |
申请号 |
KR20110055276 |
申请日期 |
2011.06.08 |
申请人 |
STS SEMICONDUCTOR & TELECOMMUNICATIONS CO., LTD. |
发明人 |
SON, JONG MYOUNG |
分类号 |
H01L23/48;H01L23/28 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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