SUBSTRATE SUPPORT APPARATUS AND METHOD FOR CHUCKING AND DE-CHUCKING SUBSTRATE USING THE SAME

摘要

PURPOSE: A substrate support apparatus and a method for chucking and de-chucking a substrate using the same are provided to separate the edge of a substrate from a chuck and to minimize the warpage of the substrate. CONSTITUTION: A substrate fixing unit(102) fixes a substrate. A lift pin(106) moves up and down through a first through hole(103). The lift pin includes an upper structure(104) and a lower structure(105). A first lifter(107) moves up and down from the lower part of a chuck body part. The first lifter includes a second through hole(108). The second lifter(109) moves up and down.