| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a system and a method which relate to a semiconductor device and separately perform routing for high speed signals and low speed signals between a semiconductor and a mother board. <P>SOLUTION: A semiconductor package 100 includes two electric contacts 118 connecting with both sides of a substrate 104 and a semiconductor device 102. The substrate defines at least one via 116 which at least partially penetrates through the substrate and extends. The semiconductor device includes a semiconductor low speed interface 133 electrically connecting with one of the electric contacts through the via and a semiconductor high speed interface 131 electrically connecting with a flexible tape. The flexible tape electrically connects with the other electric contact. <P>COPYRIGHT: (C)2013,JPO&INPIT |
