| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve the adhesion strength of a pad by inhibiting the occurrence of cracks and thereby improving the reliability as a product and contributing to the improvement of the connection reliability with a mother board and the like. <P>SOLUTION: A wiring board 10 includes: a pad 11P; an outmost insulation layer 12 covering the pad 11P, allowing a surface of the pad 11P to be exposed from its surface, and provided with an opening VH1, from which a rear surface of the pad 11P is exposed, on its rear surface; a via formed in the opening VH1; and a wiring layer 13 formed on the rear surface of the insulation layer 12 and connected to the via 13. The pad 11P is embedded in the insulation layer 12, and a side surface and the rear surface of the pad 11P contact with the insulation layer 12. The pad 11P has a first metal layer 21, a second metal layer 22 provided on the first metal layer 21, and a third metal layer 23 provided on the second metal layer 22 and connected to the via 13. A peripheral part of the second metal layer 22 retracts inward from a peripheral part of the pad 11P. <P>COPYRIGHT: (C)2013,JPO&INPIT |
