发明名称 |
INTERCONNECTION BARRIER MATERIAL DEVICE AND METHOD |
摘要 |
Interconnects containing ruthenium and methods of forming can include utilization of a sacrificial protective material. Planarization or other material removal operations can be performed on a substrate having a recess, the recess containing a ruthenium containing material along with the sacrificial protective material. The protective material is later removed, and a conductor can be filled in the remaining recess.
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申请公布号 |
US2012315754(A1) |
申请公布日期 |
2012.12.13 |
申请号 |
US201113155908 |
申请日期 |
2011.06.08 |
申请人 |
ZHU XIAOYUN;COLLINS DALE W.;LINDGREN JOSEPH;JINDAL ANURAG;MICRON TECHNOLOGY, INC. |
发明人 |
ZHU XIAOYUN;COLLINS DALE W.;LINDGREN JOSEPH;JINDAL ANURAG |
分类号 |
H01L21/768 |
主分类号 |
H01L21/768 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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