LAMINATE FILM, AND FILM FOR SEMICONDUCTOR MANUFACTURING USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a laminate film being excellent in heat resistance and stress relaxing property and being suitable as a constituent member of a film for semiconductor-manufacturing.

SOLUTION: The film has a laminate structure of two or more layers including an outermost layer, where the outermost layer comprises a thermoplastic resin composition containing a thermoplastic resin having a melting-point of 98°C or higher, and at least one layer other than the outermost layer (second layer) comprises a resin composition containing an ethylene/unsaturated carboxylic acid copolymer having 17 mass% or more of unsaturated carboxylic acid content, or its ionomer.

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