| 摘要 |
<P>PROBLEM TO BE SOLVED: To reduce deterioration of signal quality, to suppress increase of a chip area and to suppress increase of consumption current. <P>SOLUTION: In the solid-state imaging apparatus, a first substrate and a second substrate, in which circuit elements constituting a pixel are arranged, are electrically connected. The apparatus includes a plurality of pixels classified into first to n-th (n is integer of 2 or more). Each pixel includes: a photoelectric conversion element disposed on the first substrate; an amplifier circuit amplifying a signal generated in the photoelectric conversion element and outputting an amplification signal; a signal accumulation circuit which is installed on the second substrate and accumulates the amplification signal outputted from the amplifier circuit; and a control section controlling exclusive supply of drive currents to the amplifier circuits in the first to n-th pixels. <P>COPYRIGHT: (C)2013,JPO&INPIT |
