| 摘要 |
The invention relates to a method for manufacturing a card connector or a card comprising the step of depositing layers (31,32,33,34,35) of connector materials onto a substrate (10) so as to form a pattern of contacts (30) for a connector. It also comprises the step of removing the substrate (10) from the pattern of contacts (30) so as to expose the contacts (30). The substrate to be removed (10) is made of conductive material. The method comprises the step of depositing at least one layer (31,32,33,34,35) of the pattern of contacts (30) by electro-deposition by making use of the substrate to be removed (10) as a conductor for electric current used in the electro-deposition. The invention may also comprise the step of overmolding the card body compound, after having mounted and connected a chip to the connector, and before peeling off the substrate. |
