发明名称 MULTI WIRING BOARD, WIRING BOARD AND MANUFACTURING METHOD OF WIRING BOARD
摘要 <P>PROBLEM TO BE SOLVED: To provide a multi wiring board, a wiring board and a manufacturing method of wiring board in which crystal particles are prevented from falling off when being divided into pieces. <P>SOLUTION: A multi wiring board 9 is made of ceramic sintered compact and includes: a mother board 1 in which plural wiring board areas 2 are arranged in vertical and horizontal directions; and dividing grooves 4 which are formed along the boundary of the wiring board areas 2 on the main plane of the mother board 1. A part of the mother board 1 in a thickness direction is a large particle layer 1b where crystal particles of the ceramic forming the ceramic sintered compact are larger than those in the other area, and the bottom portion of the dividing groove 4 is located in the large particle layer 1b. Since the mother board 1 begins to be broken in the large particle layer 1b having high sinterability, crystal particles of the ceramic are prevented from falling off due to a breaking shock. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2012248710(A) 申请公布日期 2012.12.13
申请号 JP20110119815 申请日期 2011.05.28
申请人 KYOCERA CORP 发明人 KAYAZONO YOICHI
分类号 H05K1/02;H05K3/00 主分类号 H05K1/02
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