Multi-chip packages providing reduced signal skew and related methods of operation

摘要

A packaged integrated circuit device includes a substrate including a conductive pad thereon, and a chip stack including a plurality of chips on the substrate. A primary conductive line electrically connects the pad on the substrate to a conductive pad on one of the plurality of chips in the chip stack. Secondary conductive lines electrically connect the pad on the one of the plurality of chips to respective conductive pads on ones of the plurality of chips above and below the one of the plurality of chips in the chip stack. The primary conductive line may be configured to transmit a signal from the pad on the substrate to the pad on the one of the plurality of chips in the chip stack. After receiving the signal at the one of the plurality of chips, the secondary conductive lines may be configured to transmit the signal from the one of the plurality of chips to the ones of the plurality of chips above and below the one of the plurality of chips in the chip stack at a same time. Related methods of operation are also discussed.