| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electroless iridium plating liquid and an electroless plating method using the same, capable of forming an iridium plating film with high industrialization applicability and excellent quality directly on a copper material. <P>SOLUTION: The electroless iridium plating liquid contains at least one of a trivalent iridium ion and a tetravalent iridium ion, and a trivalent titanium ion. Examples of a compound that serves as an iridium ion supply source include iridium hexachloride trisodium, and examples of a compound that serves as a titanium ion supply source include titanium trichloride. Use of the electroless iridium plating liquid allows iridium plating to be carried out on a copper material, which has been impossible by conventional technologies. <P>COPYRIGHT: (C)2013,JPO&INPIT |
