发明名称 SUBSTRATE DRYING METHOD AND SUBSTRATE PROCESSING APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To prevent pattern collapse when a substrate is dried by removing a liquid on the substrate having a pattern of protrusions and recesses formed on the surface. <P>SOLUTION: A method of drying a substrate by removing a liquid on the substrate having a pattern of protrusions and recesses formed on the surface includes a sublimable substance filling step for filling the recesses of the pattern with a solution by supplying a solution (SL) of a sublimable substance to the substrate, a solvent drying step for filling the recesses of the pattern with the sublimable substance (SS) in solid state by drying the solvent in the solution, and a sublimable substance removal step for removing the sublimable substance from the substrate by heating the substrate at a temperature higher than the sublimation temperature of the sublimable substance. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2012243869(A) 申请公布日期 2012.12.10
申请号 JP20110110677 申请日期 2011.05.17
申请人 TOKYO ELECTRON LTD 发明人 SEKIGUCHI KENJI;FUJII YASUSHI
分类号 H01L21/304 主分类号 H01L21/304
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