| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a separation device and a separation method that can surely separate an adhesive sheet from a plate-like member, while minimizing an occupying space to a floor surface. <P>SOLUTION: This separation device 1 includes a first sheet support means 2 for supporting a first adhesive sheet S1, a second sheet support means 3 for supporting a second adhesive sheet S2 by a support surface 31 contacting with the other surface side of the second adhesive sheet S2, an abutting means 4 for sandwiching a wafer W with the second sheet support means 3 by contacting an abutting surface 4A with the other surface of the first adhesive sheet S1, a moving means 5 for relatively moving the first sheet support means 2 and the second sheet support means 3 in the orthogonal direction to the support surface 31, and a rotary means 6 for relatively rotating the first sheet support means 2 and the second sheet support means 3 on a plane parallel to the support surface 31. <P>COPYRIGHT: (C)2013,JPO&INPIT |
