发明名称 INSULATING SUBSTRATE, METHOD FOR THE SAME, SEMICONDUCTOR MODULE AND SEMICONDUCTOR DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide an insulating substrate comprising an insulating layer formed by applying a thermal sprayed ceramic powder onto one surface of a conductive substrate, which improves insulation performance at the lateral end face in a simple configuration and at a lower cost. <P>SOLUTION: A taper surface 1Ac is formed at a corner on a first surface 1a of a conductive base material 1A and an insulating layer 7A is formed by applying a thermal sprayed ceramic powder onto the first surface 1a and the taper surface 1Ac, thereby composing an insulating substrate 11A. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2012244026(A) 申请公布日期 2012.12.10
申请号 JP20110114383 申请日期 2011.05.23
申请人 FUJI ELECTRIC CO LTD 发明人 WATANABE AKANE;OKAMOTO KENJI
分类号 H01L23/34 主分类号 H01L23/34
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